 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| PA75 P r o d u c t I n n o v a t i o nF r o m ABSOLUTE MAXIMUM RATINGS SUPPLY VOLTAGE, total OUTPUT CURRENT POWER DISSIPATION, internal, (per amplifier) POWER DISSIPATION, internal (both amplifiers) INPUT VOLTAGE, differential INPUT VOLTAGE, common mode JUNCTION TEMPERATURE, max1 TEMPERATURE, pin solder--10 sec max TEMPERATURE RANGE, storage OPERATING TEMPERATURE RANGE, case TEST CONDITIONS 2 MIN 5V to 40V SOA 19.5W 28.6W VS +VS, -VS-0.5V 150C 220C -55C to 150C -40C to 125C TYP 1 20 100 MAX 15 500 +VS-1.3 UNITS mV V/C nA V dB dB dB nV/Hz dB MHz kHz 1.5 A V/s V V % V mA C/W C/W C/W C/W C/W C/W C SpECiFiCATiOnS PARAMETER INPUT OFFSET VOLTAGE, initial OFFSET VOLTAGE, vs. temperature BIAS CURRENT, initial COMMON MODE RANGE COMMON MODE REJECTION, DC POWER SUPPLY REJECTION CHANNEL SEPARATION INPUT NOISE VOLTAGE GAIN OPEN LOOP GAIN GAIN BANDWIDTH PRODUCT PHASE MARGIN POWER BANDWIDTH OUTPUT CURRENT, peak SLEW RATE VOLTAGE SWING VOLTAGE SWING HARMONIC DISTORTION POWER SUPPLY VOLTAGE, VSS3 CURRENT, quiescent, total THERMAL RESISTANCE,DC junction to case (single) RESISTANCE,AC junction to case (single) RESISTANCE,DC junction to case (both) RESISTANCE,AC junction to case (both) RESISTANCE,junction to air (CD,CX) RESISTANCE,junction to air (CC)4 TEMPERATURE RANGE,case Full temperature range Full temperature range Full temperature range Full temperature range IOUT = 500mA, = 1kHz RS = 100, = 1 to 100kHz Full temperature range AV = 40dB Full temperature range, RL = 2K, CL = 100pF VO(P-P) = 28V -VS 60 60 50 90 90 68 22 100 1.4 65 13.6 89 0.9 Full Temperature Range, IO = 100mA Full Temperature Range, IO = 1A AV = 1, R2 = 50, VO = .5VRMS, = 1kHz 1 |VS| - 1.1 |VS| - 1.8 1.4 |VS| - .8 |VS| - 1.4 .02 30 8 5.84 4.38 3.97 2.98 60 27 40 10 6.42 4.81 4.36 3.27 85 5 Meets full range specifications -25 NOTES: 1. Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation to achieve high MTTF. 2. Unless otherwise noted, the following conditions apply: VS = 15V, TC = 25C. 3. +VS and -VS denote the positive and negative supply rail respectively. VSS denotes the total rail-to-rail supply voltage. 4. Heat tab attached to 3/32" FR-4 board with 2oz. copper. Topside copper area (heat tab directly attached) = 1000 sq. mm, backside copper area = 2500 sq. mm, board area = 2500 sq. mm. 2 PA75U P r o d u c t I n n o v a t i o nF r o m PA75 NORMALIZED BIAS CURRENT, IB (mA) NORMALIZED OFFSET VOLTAGE, VOS (mV) 24 TOTAL SUPPLY VOLTAGE, VS (V) 20 16 12 8 4 QUIESCENT CURRENT 160 CASE TEMPERATURE, TC (C) 120 80 40 0 -40 BIAS CURRENT 2.5 2 1.5 1 0.5 0 -0.5 -100 -50 0 50 -100 CASE TEMPERATURE, TC (C) 150 3 2.5 2 1.5 1 0.5 0 -100 OFFSET VOLTAGE 0 -80 1.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 NORMALIZED QUIESCENT CURRENT, IQ (mA) -50 0 50 100 TEMPERATURE, TC (C) 150 PHASE MARGIN vs. OUTPUT LOAD CAPACITANCE 65 PHASE MARGIN, () +VS = +15V -VS = -15V RL = 2K AV = -100 GAIN, A (dB) VOLTAGE GAIN & PHASE vs. FREQUENCY VOLTAGE DROP FROM SUPPLY, (V) 60 90 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 OUTPUT VOLTAGE SWING 45 20 +VS = +15V -VS = -15V RL = 2K 1 100 1K 10 FREQUENCY, f (KHz) 110 35 0 120 PHASE, () 55 40 100 25 2.0 0.4 0.8 1.2 1.6 0.0 OUTPUT LOAD CAPACITANCE, CL (nF) 10 8 OUTPUT VOLTAGE, VO (V) 6 4 2 0 -2 -4 -6 -8 -10 0 -VS = -15V RL = 20 fIN = 20kHz +VS = +15V AV = +1 VIN = 10Vp OUTPUT VOLTAGE, VO (V) -20 130 10K 0 0.1 0.5 0.9 0.7 0.3 OUTPUT CURRENT, IO (A) PULSE RESPONSE 10 8 6 4 2 0 -2 -4 -6 -8 -10 0 PULSE RESPONSE +VS = +15V AV = +1 VIN = 10Vp -VS = -15V fIN = 1kHz 10 20 30 40 TIME, t (s) 50 60 70 200 400 600 800 1000 1200 1400 TIME, t (s) PA75U 3 PA75 GEnErAL P r o d u c t I n n o v a t i o nF r o m THERMAL CONSIDERATIONS The PA75CD and CX have a large exposed copper heat tab to which the monolithic is directly attached. The PA75CD and CX may require a thermal washer, which is electrically insulating since the tab is directly tied to -VS. This can result in a thermal impedance RCS of up to 1C/W or greater. The PA75CC has a large exposed integrated copper heatslug to which the monolithic is directly attached. The solder connection of the heatslug to a minimum of 1 square inch foil area of the printed circuit board will result in thermal performance of 25C/W junction to air rating of the PA75CC. Solder connection to an area of 1 to 2 square inches of foil is required for minimal power applications Where the PA75CC is used in higher power applications, it is necessary to use surface mount techniques of heatsinking. Surface mount techniques include the use of a surface mount fan in combination with a surface mount heatsink on the backside of the FR4/ PC board with through hole thermal vias. Other highly thermal conductive substrate board materials are available for maximum heat sinking. POWER DERATING W 5 0 25 20 15 10 5 0 TWO AMPLIFIERS LOADED P IPATION Please read Application Note 1 "General Operating Considerations" which covers stability, supplies, heatsinking, mounting, SOA interpretation, and specification interpretation. Visit www. Cirrus.com for design tools that help automate tasks such as calculations for stability, internal power dissipation, heatsink selection; Apex Precision Power's complete Application Notes library; Technical Seminar Workbook; and Evaluation Kits. STABILITY CONSIDERATIONS All monolithic power + op amps use output stage topologies that present special stabil- C SN ity problems. This is 0.01F primarily due to noncomplementary (both R SN d ev i c e s a re N P N ) 10 output stages with a mismatch in gain and phase response for different polarities of output current. It is difficult for the op amp manufacturer to optimize compensation for all operating conditions. For applications with load current exceeding 300ma, oscillation may appear. The oscillation may occur only with the output voltage swing at the negative or positive half cycle. Under most operating and load conditions acceptable stability can be achieved by providing a series RC snubber network connected from the output to ground. The recommended component values of the of the network are,RSN = 10 and CSN = 0.01F. Please refer to Application Note 1 for further details. ONE AMPLIFIER LOADED SAFE OPERATING AREA (SOA) The SOA curves combine the effect of all limits for this power op amp. For a given application, the direction and magnitude of the output current should be calculated or measured and checked against the SOA curves. This is simple for resistive loads but more complex for reactive and EMF generating loads. OUTPUT CURRENT FROM +VS or -VS (A) 10.0 INTERNA POWER DI 0 25 50 5 100 CASE TEMPERATURE, TC (C) 125 MOUNTING PRECAUTIONS 1. Always use a heat sink. Even unloaded the PA75 can dissipate up to .4 watts. 2. Avoid bending the leads. Such action can lead to internal damage. 3. Always fasten the tab of the CD and CX package to the heat sink before the leads are soldered to fixed terminals. 4. Strain relief must be provided if there is any probability of axial stress to the leads. SOA TWO AMPLIFIERS LOADED DC, TC = 25C 1.0 ONE AMPLIFIER LOADED DC, TC = 85C 0.1 1.0 10.0 100.0 SUPPLY TO OUTPUT DIFFERENTIAL VOLTAGE, VS - VO (V) 4 PA75U |
Price & Availability of PA75
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |